產(chǎn)品更換通知:LITTELFUSE 將要改變DO-214AB 的封裝 ?
型 號DO-214AC Package
產(chǎn) 地廣東省 深圳市
最小起訂
1臺
供貨總量
12234臺
發(fā)布時間
2014-12-01
有效日期
已過期
Littelfuse DO-214AC Package Process Upgrade – matrix lead-frame design.
Similar to LFPCN41196 issued last year in which Littelfuse migrated DO-214AB package from single strip design to matrix lead frame design ( Automation Structure ), This PCN is to upgrade another package DO-214AC to be matrix lead-frame design.
This new matrix design in DO-214AC packages will allow Littelfuse to align the same matrix structure design using among full DO-214AC series products, existing DO-214AA as well as DO-214AB products.
The matrix lead frame structure design will contribute great improvement in terms of automation, quality, productivity increasing as well as capacity expansion
The scope of change will cover full DO-214AC packages from Semiconductor Business Unit (SBU) products including SIDACTor® devices, SIDAC and Commodity TVS, Please refer to attachment for details and affected PNs.
There are no changes to fit, form, and function of the finished product.
Qualification efforts are completed. Please see the attached documentation
All affected products have been fully qualified in accordance with established performance and reliability criteria. The attached pages summarize the qualification results. Full qualification data and/or samples will be available upon request.
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